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【英文标准名称】:Attachmentmaterialsforelectronicassembly-Part1-2:Requirementsforsolderingpasteforhigh-qualityinterconnectsinelectronicsassembly
【原文标准名称】:电子组件用连接材料.第1-2部分:电子组件中高质量互连接件用焊剂的要求
【标准号】:IEC61190-1-2-2007
【标准状态】:现行
【国别】:国际
【发布日期】:2007-04
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC91
【标准类型】:()
【标准水平】:()
【中文主题词】:合金;组件;化学成分;定义;电气工程;电子工程;架设(施工作业);填充料;助熔剂;交货形式;检验;糊焊料;质量;形状;软焊料;焊剂;焊料;探头;规范(验收);测试;含锡合金;焊接工程
【英文主题词】:Alloys;Assemblies;Chemicalcomposition;Connectiontechnology;Definitions;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Erecting(constructionoperation);Fillers;Fluxes;Fluxes(materials);Formofdelivery;Inspection;Pastesolder;Pastes;Quality;Qualityassurance;Shape;Softsolders;Solderingpastes;Solders;Soundingheads;Specification(approval);Testing;Tin-containingalloys;Weldingengineering
【摘要】:ThispartofIEC61190specifiesgeneralrequirementsforthecharacterizationandtestingofsolderpastesusedtomakehigh-qualityelectronicinterconnectionsinelectronicsassembly.Thisstandardservesasaqualitycontroldocumentandisnotintendedtorelatedirectlytothematerial'sperformanceinthemanufacturingprocess.Relatedinformationonfluxcharacterization,qualitycontrolandprocurementdocumentationforsolderfluxandfluxcontainingmaterialmaybefoundinIEC61190-1-1.
【中国标准分类号】:L10;J33
【国际标准分类号】:31_190
【页数】:18P.;A4
【正文语种】:英语